Call for Papers
The ECS Journal of Solid State Science and Technology is publishing a focus issue on Emerging Trends in CMP. Chemical Mechanical Planarization (CMP) is a widely accepted global planarization technology that has been deployed by integrated circuit (IC) manufacturers across the globe. It is considered a critical and enabling step in IC manufacturing. A CMP process requires a correct combination of CMP consumables such as slurry, pad, pad conditioner, and cleaning chemistries, along with equipment and end point technology. As device fabrication advances to sub-7 nm nodes, it is critical that advances in CMP can meet future challenges for these advanced CMP processes. A lot of research is being performed in the CMP area. This focus issue is intended to bring high quality research articles to the scientific community.
This virtual issue focuses on papers covering the following topics: (more…)