The 227th ECS Meeting is in Chicago, IL from May 24 – 28, 2015

The call for abstracts for the 227th ECS Meeting to be held May 24-28, 2015 in Chicago, IL is now open.

Meeting abstracts should explicitly state objectives, new results, and conclusions or significance of the work.

Regardless of whether you submit as a poster or an
oral presentation, it is at the symposium organizers’ discretion whether it is scheduled for an oral or poster presentation.

Programming for this meeting will occur in January 2015.

Abstracts are due no later than November 14, 2014.

Find out more.

This focus issue will cover state-of-the-art efforts that address a variety of approaches to printable functional materials and devices.

Printing technologies in an atmospheric environment offer the potential for low-cost and materials-efficient alternatives for manufacturing electronics and energy devices such as luminescent displays, thin film transistors, sensors, thin film photovoltaics, fuel cells, capacitors, and batteries.

Significant progress has been made in the area of printable functional organic and inorganic materials including conductors, semiconductors, dielectric, and luminescent materials

These will enable exciting advances in printed electronics and energy devices. Some examples are printed amorphous oxide semiconductors, organic conductors and semiconductors, inorganic semiconductor nanomaterials, silicon, chalcogenide semiconductors, ceramics, metals, intercalation compounds, and carbon-based materials.

This focus issue will cover state-of-the-art efforts that address a variety of approaches to printable functional materials and device. The focus issue will include both invited and contributed papers reflecting recent achievements. Prospective authors are encouraged to submit contributions reporting the original research results or reviewing key emerging trends in printable functional materials and devices for publication in this focus issue.

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Workshop on Defects in Wide Band Gap Semiconductors
September 23, 2014
University of Maryland, College Park

Call for abstracts.

CALL FOR ABSTRACTS

Abstracts accepted in the following categories:

GALLIUM NITRIDE AND SILICON CARBIDE AND RELATED COMPOUNDS

• Origin of defects in wide band-gap semiconductors
• Extended defects in wide band-gap semiconductors
• Defect reduction strategies
• Atomic level control of material growth
• Growth optimization and growth yield
• Defect dynamics in extreme environments

WIDE BANDGAP POWER DEVICES

• Defect-device performance-reliability correlations
• Defect-manufacturing yield correlations
• Role of defects in wide bandgap power electronics
• Defect modeling and defect-device performance models
• Defect characterization, in-situ and in real time
• Advanced defect characterization in both ground and excited states
• Defect modeling in ground and excited states
• Manufacturing yield and cost reduction strategies

Instructions and submission template.

DEADLINE JULY 28

Here’s our latest Call for Papers:

Atomic Layer Etch (ALEt) and Atomic Layer Clean (ALC) are emerging as enabling technologies for sub 10nm technology nodes. At these scales performance will be extremely sensitive to process variation.

Atomic layer processes are the most promising path to deliver the precision needed. However, many areas of ALEt and ALC are in need of improved fundamental understanding and process development. This focus issue will cover state-of-the-art efforts that address a variety of approaches to ALE and ALC.

Topics of interest include but are not limited to:

• Surface reaction chemistry and its impact on selectivity
• Plasma ion energy distribution and control methods
• Novel plasma sources and potential application to ALEt & ALC
• Innovative approaches to atomic layer material removal
• Novel device applications of ALEt & ALC
• Process chamber design considerations
• Advanced delivery of chemicals to processing chambers
• Metrology and control of ALEt & ALC
• Device performance impact
• Synthesis of new chemistries for ALEt & ALC application
• Damage free surface defect removal
• Process and discharge modeling

FIND OUT MORE!

Deadline for submission of manuscripts | December 17, 2014