ECS Transactions (ECST) is the official meeting proceedings of The Electrochemical Society. This publication features full-text content of proceedings from ECS meetings and ECS-sponsored meetings. For a full listing of available volumes and issues, or to purchase individual articles, please visit the ECS Transactions page of the ECS Digital Library. Full issues may be purchased through the ECS Online Store.
New for 2018 – All authors are welcome to submit a full-text preprint, slides, or other presentation-related materials to the new preprint server, ECSarXiv.
**Important information regarding changes to standard issues of ECST**
Beginning with AiMES 2018, ECST will no longer publish standard issues for ECS biannual meetings. Instead, this content will be eligible for submission to ECS’s new preprint server platform, ECSarXiv. Although the enhanced issues of ECST will remain unchanged, enhanced authors will also have the opportunity to submit slideshows, posters, or data based on their AiMES presentation to the preprint server. More information about ECSarXiv can be found here.
ECST author instructions and information on manuscript preparation can be found here.
Questions? Contact ECST staff at email@example.com
ECST submission deadlines: AiMES 2018
|Dec. 8, 2017||All Request-to-Publish forms due|
|March 30, 2018||Meeting Abstract deadline|
|June 1, 2018||ECST submission site opens to authors and editors|
|June 29, 2018||ECST submission site closes to authors|
|July 27, 2018||ECST submission site closes to editors|
|Sept. 21, 2018||Release date for ECS Transactions issues (9 days before first day of meeting)|
AiMES 2018 symposia publishing ECS Transactions issues:
|C02||Pits & Pores 8: Nanomaterials – Fabrication, Properties, and Applications|
|D01||Semiconductors, Dielectrics, and Metals for Nanoelectronics 16|
|D04||Nonvolatile Memories 6|
|D06||Surface Characterization and Manipulation for Electronic Applications|
|F01||Electrochemical Engineering General Session|
|F04||Characterization of Electrochemical Reactors: Fluid Dynamics and Current Distribution|
|G01||Semiconductor Wafer Bonding: Science, Technology, and Applications 15|
|G02||Atomic Layer Deposition Applications 14|
|G03||SiGe, Ge, and Related Materials: Materials, Processing, and Devices 8|
|G05||Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB|
|H01||State-of-the-Art Program on Compound Semiconductors 61 (SOTAPOCS 61)|
|H02||High Purity and High Mobility Semiconductors 15|
|H03||Thin Film Transistor Technologies 14 (TFTT 14)|
|H04||Low-Dimensional Nanoscale Electronic and Photonic Devices 11|
|H05||Gallium Nitride and Silicon Carbide Power Technologies 8|
|I01||Polymer Electrolyte Fuel Cells and Electrolyzers 18 (PEFC&E 18)|
|L02||Molten Salts and Ionic Liquids 21|
|M01||Chemical Sensors 14: Chemical and Biological Sensors and Analytical Systems|
|M02||Wearable Sensors and Systems 1 -and- Microfabricated and Nanofabricated Systems for MEMS/NEMS 14|
Journal submission information
All authors of accepted meeting abstracts and/or ECST papers are encouraged to submit their papers to an ECS journal. While the expectation is that six months is sufficient time to revise an abstract and/or ECST paper to meet the stricter standards of the journals, there is no deadline for submission with ECS’s continuous journal publication model.
Submissions to the journals must be made using the online submission system. Click here for author instructions and to submit your manuscript.
Please note: There is no conflict should an author wish to submit their work to both ECST and an ECS journal.
Would you like to make your work freely available to researchers across the globe? Consider publishing your paper as Author Choice Open Access. Make sure to read about open access with ECS and learn how to get involved with the Free the Science initiative!