Topic Close-up #16

Symposium: G02—Atomic Layer Deposition and Etching Applications 18

Deadline for Submitting Abstracts:
April 22, 2022

 

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Topic Close-up #15

Symposium: G03—SiGe, Ge, and Related Materials: Materials, Processing, and Devices 10

Deadline for Submitting Abstracts:
April 22, 2022

 

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Early Career Forum

The ECS Electrodeposition Division (ELDP) launched the Early Career Forum (ECF) to bring together PhD and MSc students, postdocs, and starting assistant professors or young professionals around the world doing research in electroless and electrochemical deposition and related fields. The forum aims to be a platform for the regular exchange of ideas, including short talks and open discussion sessions, allowing the members to benefit from the experience of other early career researchers. The format is similar to ECS Student Chapters, but on an international level. (more…)

Topic Close-up #14

Symposium: E04: 100 Years of the Electrodeposition Division: Past, Present, and Future

Deadline for Submitting Abstracts:
April 22, 2022

 

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Topic Close-up #13

Symposium: E03: Electrochemical and Electrophoretic Deposition of Ceramics, Oxides, and Composites

Deadline for Submitting Abstracts:
April 22, 2022

 

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Topic Close-up #12

Symposium: E02: Electrochemical and Electroless Deposition of Functional Materials (Theory, Numerical Simulations, and Applications) 2

Deadline for Submitting Abstracts:
April 22, 2022

 

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Topic Close-up #11

Symposium: E01 – Electrodeposition for Energy Applications 6

Deadline for Submitting Abstracts:
April 22, 2022

 

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Topic Close-up #10

Symposium: D03: Advanced 3D Interconnect Technologies and Packaging

Deadline for Submitting Abstracts:
April 22, 2022

 

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Fig. 3, Journal of The Electrochemical Society, 2020 167 037510

Topic Close-up #9

Symposium: L07: Electrochemistry of Mononuclear and Polynuclear Cyano-complexes

Deadline for Submitting Abstracts:
April 22, 2022

 

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Topic Close-up #8

Symposium: D04—Plasma and Thermal Processes for Materials Modification, Synthesis, and Processing 4

Deadline for Submitting Abstracts:
April 22, 2022

 

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