Scientists have figured out how to make tiny individual films—each just a few atoms high—and stack them for use in new kinds of electronics.
Over the past half-century, scientists have shaved silicon films down to just a wisp of atoms in pursuit of smaller, faster electronics. For the next set of breakthroughs, though, they’ll need new ways to build even tinier and more powerful devices.
In a study that appears in Nature, researchers describe an innovative method to make stacks of thin, uniform layers of semiconductors just a few atoms thick which could expand capabilities for devices like solar cells and cell phones.
Stacking thin layers of materials offers a range of possibilities for making electronic devices with unique properties. But manufacturing them is a delicate process, with little room for error, researchers say.
“The scale of the problem we’re looking at is, imagine trying to lay down a flat sheet of plastic wrap the size of Chicago without getting any air bubbles in it,” says Jiwoong Park, a professor of chemistry at the University of Chicago and at the Institute for Molecular Engineering and the James Franck Institute. “When the material itself is just atoms thick, every little stray atom is a problem.”



A team of engineers from Monash University have successfully test-fired the world’s first 3D printed rocket engine. By utilizing a unique aerospike design, the team, led by ECS fellow 
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