Deadline for Submitting Abstracts
March 16, 2018
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Symposium G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15
Symposium Focus: The fifteenth symposium solicits original theoretical and experimental papers that document new developments and cover the full range of basic science, process technologies, and product applications of semiconductor wafer bonding (direct, anodic, thermo-compression, eutectic, adhesive bonding). Besides permanent bonding, temporary wafer bonding technique deserves also to be discussed regarding all the recent development in many 3D applications. Fundamental aspects of interest include surface preparations for bonding, film transferring, low temperature bonding, surface activation at bonding interfaces, bonding techniques, novel material composites to synthesize heterostructures. Presentations characterizing currently utilized materials and processes, as well as novel approaches to new materials systems and modeling and process simulations are encouraged. Practical aspects of interest include innovative developments in product architecture and new integration and processing schemes for microelectronics, photonics, MEMS, microtechnologies, nanotechnologies and other relevant applications.
Invited Speakers from CEA-Leti, imec, EVG, KTH, Qromis, and more will be featured during the symposium.


In order to power entire communities with clean energy, such as solar and wind power, a reliable backup storage system is needed to provide energy when the sun isn’t shining and the wind doesn’t blow.
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Using advanced computational methods, University of Wisconsin–Madison materials scientists have discovered new materials that could bring widespread commercial use of solid oxide fuel cells closer to reality.
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A collaborative team of researchers from Shinshu University in Japan have found a new way to curb some of the potential dangers posed by lithium ion batteries.
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Deadline Extended: March 19, 2018