2013

Spring — 223rd ECS Meeting, Toronto, ON, Canada

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2012

Fall — PRiME 2012, Honolulu, HI

Spring — 221st ECS Meeting, Seattle, WA

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2011

Fall — 220th ECS Meeting, Boston, MA

Spring — 219th ECS Meeting, Montreal, Canada, CA

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2010

Fall — 218th ECS Meeting, Las Vegas, NV

Spring — 217th ECS Meeting, Vancouver, Canada

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2009

Fall — 216th ECS Meeting, Vienna, Austria

Spring — 215th ECS Meeting, San Francisco, CA

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2008

Fall — PRiME 2008, Honolulu, Hawaii

Spring — 213th ECS Meeting, Phoenix, AZ

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2007

Fall

• Electrodeposition of Magnetic Materials
  Stanko Brankovic and Giovanni Zangari
• PEM Fuel Cells
  Hubert Gasteiger and Stu Adler
• Basics of Impedance Spectroscopy
  Mark E. Orazem
• Lithium Ion Battery Materials
  Martin Winter and Y. Shirley Meng
• Basic Electrochemical Measurements
  Bill Eggers
• Basics of Cleaning Processing for Integrated Circuit Manufacturing
  Karen Reinhardt, Jeffrey Butterbaugh, and Robert Small

Spring

• Nanostructured Carbon Materials
  Dirk M. Guldi
• Impedance Spectroscopy
  Mark Orazem

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2006

Fall

• Basic Electrochemical Measurements
  Bill Eggers
• PEM Fuel Cells
  Eric Stuve and Hubert Gasteiger
• Basics of Impedance Spectroscopy
  Mark E. Orazem
• Fundamentals and Applications of Electrochemical Capacitors
  John R. Miller
• Electrochemical Nanotechnology
  Stephen Lipka
• Electrical Characterization and Characteristics of MOS Devices with Ultrathin (0.5-1.5 nm) High-k Gate Dielectrics
  Samares Kar

Spring

• Fullerenes and Carbon Nanotubes
  Dirk M. Guldi and R. Bruce Weisman
• Understanding the Finite Element Method
  Bruce A. Finlayson
• Battery Design and Simulation
  Robert Spotnitz
• Impedance Spectroscopy
  Mark E. Orazem

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2005

Fall

• Fundamentals of Atomic Force Microscopy for Electrochemical Applications
  K. Jones (Asylum Research)
• Basics of Impedance Spectroscopy
  P. Agarwal (Fideris Test Solutions) and M. Orazem (University of Florida)
• Basics of Cleaning Processes for Integrated Circuit Manufacturing
  K. Reinhardt, (Cameo Consulting), J. Butterbaugh (FSI International), J. Farber (Lam Research Corporation), and R. Small (EKC Technology)
• Electrical Characterization and Characteristics of
  MOS Devices with Ultrathin (0.5-1.5 nm) High-K Gate Dielectrics
  S. Kar (India Institute of Technology)
• Electroplating for ULSI and Microelectronic Circuitry: Theory and Applications
  T. Dinan and R. Contolini (Electrolytics)
• Nanomaterials for Nanotechnology
  ZLWang (Georgia Institute of Technology)
• Solid State Lighting
  A. Srivastava (General Electric Global Research) and
  I. Ferguson (Georgia Institute of Technology)
• PEM Fuel Cells
  H. Gasteiger (General Motors) and E. Stuve (University of Washington)
• Battery Design and Simulation
  R. Spotnitz (Battery Design LLC)

Spring

• Electrochemical Nanotechnology
  S. Lipka (U. of Kentucky)
• Impedance Spectroscopy: Theory and Applications
  M. E. Orazem (U. of Florida)
• SOFC Fuel Cells
  A. Virkar (U. of Utah) and S. Adler (U. of Washington)

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2004

Fall

• Battery Design and Simulation
  R. Spotnitz (Battery Design Company)
• Electrochemical Nanotechnology
  S. Lipka (U. of Kentucky)
• Fundamentals and Applications of Electrochemical Capacitors
  B. Conway (U. of Ottawa) and J. Miller (JME)
• Impedance Spectroscopy: Theory and Applications
  M. E. Orazem (U. of Florida)
• Integration of Copper Metallization and Low-k
  Dielectrics for ULSI Interconnects and Its Reliability
  H. Rathore (IBM) and D. B. Nguyen (IBM)

Spring

• Battery Design and Simulation
  R. Spotnitz (Battery Design Company)

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2003

Fall

• Basics of Cleaning Processes for Integrated
  Circuit Manufacturing, K. Reinhardt (NOVELLUS)
  J. Butterbaugh (FSI International), J. Farber (Lam Research Corporation), and R. Small (EKC Technology)
• Battery Design and Simulation
  R. Spotnitz (Battery Design Company)
• Impedance Spectroscopy: Theory and Applications
  M. E. Orazem (U. of Florida)
• Principles of PEM Fuel Cell Engineering-I:
  Water Management and Flow Field Plate Design
  E. Stuve (U. of Washington)

Spring

• Fundamentals and Applications of Electrochemical Capacitors
  B. Conway and J. Miller
• Impedance Spectroscopy: Theory and Applications
  M. E. Orazem (U. of Florida)

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2002

Fall

• Battery Design and Simulation
  R. Spotnitz (Battery Design Company)
• Lithium Ion Batteries
  Thomas B. Reddy (Rutgers University) and K. M. Abraham (E-KEM Sciences)
• Principles of PEM Fuel Cell Engineering-I:
  Water Management and Flow Field Plate Design
  Eric M. Stuve (U. of Washington)

Spring

• Plasma Processing of Low-K Dielectric Films
  D. W. Hess
• Fundamentals and Applications of Electrochemical Capacitors
  B. Conway and J. Miller
• Impedance Spectroscopy: Theory and Applications
  M. E. Orazem (U. of Florida)

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2001

Fall

• Impedance Spectroscopy
  M. E. Orazem
• Battery Design and Simulation
  R. Spotnitz
• Chemical Mechanical Polishing
  K. B. Sundaram
• PEM Fuel Cells
  T. Zawodzinski

Spring

• Integrated Circuit Fabrication and Yield Control
  E. Levine
• Plasma Processing of Low-K Dielectric Films
  D. W. Hess

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2000

Fall

• Battery Failure Analysis
  S. C. Levy
• Microfabrication Techniques
  P. J. Hesketh and D. Babic
• Electrochemistry in Medical Research
  B. E. Conway and R. Eberhardt
• Luminescence and Luminescent Materials
  C. Ronda, A. Meijerink, J. McKittrick, and A. Srivastava
• Chemical Mechanical Planarization: Fundamentals and Practice
  V. Desai, A. Dogariu, K. Richardson, S. Seal, K. Sundaram, and W. Easter

Spring

• Impedance Spectroscopy
  M. E. Orazem

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1999

Fall

• Chemical Analysis with Microsensors and Microsystems
  A. J. Ricco and D. J. Harrison
• The Integration of Copper Metallization and
  Low k-Dielectrics for ULSI Interconnects, and Its Reliability
  H. S. Rathore and D. B. Nguyen
• Lithium Ion and Lithium Polymer Batteries
  B. Scrosati, S. C. Levy, and T. Osaka
• Plasma Processing for 180 nm Devices
  D. E. Ibbotson and D. W. Hess
• Simulation of Nanoscale Materials and Devices
  P. A. von Allmen and J.-P. Leburton

Spring

• 21st Century Tools for Acceleration of Technological Innovation
  J. P. Dismukes and J. R. Susko

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1998

Fall

• Simulation of Nanoscale Materials and Devices
  P. von Allmon and J.-P. Leburton
• Processes, Materials, and Electrochemical
  Characterization of Thin Film Transistors
  Y. Kuo, M. Hack, and D. Ast
• Fundamentals of Microfabrication Techniques
  P. J. Hesketh and D. Babic

Spring

• Copper Metallization for Sub-Micron Integrated Circuit Technology
  H. S. Rathore and D. Nguyen
• Microelectronic Packaging Technology
  S. S. Ang
• Semiconductor Metrology
  K. B. Sundaram and V. H. Desai

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1997

Fall

• Electromagnetic Compliance and Interference (EMC & EMI/RFI) and
  Electrostatic Discharge (ESD): Materials Reliability and Corrosion Issues
  R. Haynes and R. P. Frankenthal
• Lithium Ion Battery Technology
  S. C. Levy and B. Scrosati
• Introduction to Systems Design, Integration and Testing for Device Engineers
  V. Swaminathan

Spring

• Electromagnetic Compliance and Interference (EMC & EMI/RFI) and
  Electrostatic Discharge (ESD): Materials Reliability and Corrosion Issues
  R. Haynes and R. P. Frankenthal
• Fundamentals and Applications of Electrochemical Capacitors
  B. E. Conway and J. Miller
• Simulation of Nanoscale Materials and Devices
  P. von Allmen and J.-P. Leburton

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1996

Fall

• Processes, Materials, and Electrical Properties of Thin Film Transistors
  Y. Kuo, M. Hack, and D. G. Ast
• Battery Failure Analysis
  S. C. Levy
• Electrochemical and Controlled Environment Scanning Probe Microscopy
  S. Lindsay, K. Sieradzki, D. Yaniv, N. Tao, S. Pfeiffer, and M. Flowers

Spring

• Multichip Module Packaging Technology
  S. S. Ang

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