212th ECS Meeting - Washington, DC

October 7 - October 12, 2007

PROGRAM INFORMATION
 

F2 - Electrodeposition of Nanoengineered Materials and Alloys 2

Electrodeposition
 

Monday, October 8, 2007

Military Room, Concourse Level

N/A

Co-Chair(s): G. Zangari and J. Mallets
TimeAbs#Title and Authors
10:30   1356   Nanometer-Scale Spatiotemporal Control of Environmentally-Responsive Materials by In-Plane Electrochemical Gradient Formation. X. Wang, P. Shi and P. W. Bohn (University of Notre Dame)
11:00   1357   Fabrication and Assembly of Electrodeposited Multisegmented Nanstructures D. Gracias (Johns Hopkins University)
11:30   1358   Synthesis, Assembly, and Characterization of One-Dimensional Nanostructures C. M. Hangarter, M. Bangar, Y. Rheem, B. Yoo (University of California Riverside) and N. Myung (University of California, Riverside)
 
Co-Chair(s): N. V. Myung and N. J. Tao
TimeAbs#Title and Authors
14:00   1359   Electrochemical Preparation of Nanoscale Electrocatalysts of Well-Defined Structure S. Sun, N. Tian, Z. Zhou, X. Zhou, Q. Chen, Y. Chen and S. Chen (Xiamen University)
14:30   1360   Anisotropic Island Growth: A New Approach for Thin Film Deposition L. Guo and P. Searson (Johns Hopkins University)
14:50   1361   Electrochemical Formation of Ta and Ti Oxide Etch Masks from an Anodized Al Template for Formation of Quantum Semiconductor Wires C. L. Arvin (IBM) and A. Miller (University of Notre Dame)
15:10   1362   Novel One-Dimentional Anodic Aluminum Oxide Array Template: Applications for Nanowire and Nanotube Array Growth Z. Chen, R. Zhu and H. Zhang (University of Kentucky)
15:30 Intermission (20 Minutes)
 
TimeAbs#Title and Authors
15:50   1363   Selective Electrochemistry of Carbon Nanotube Defects P. G. Collins, V. Khalap, B. Goldsmith and Y. Fan (Univ. of California, Irvine)
16:20   1364   Pt Nanofilms Formation Using Surface Limited Redox Replacement of Cu UPD: Flow Cell Studies D. Vairavapandian and J. L. Stickney (University of Georgia)
16:40   1365   Formation of Porous Ruthenium Layer on Porous Silicon Template M. Hayase, Y. Saito, K. Kondo and J. Brito-Neto (Tokyo University of Science)
17:00   1366   Effects of Mechanical Attrition on the Microstructure and Characteristics of Electrochemical and Electroless Plated Films Y. He, Z. Ning, Z. Ping and H. Fu (University of Science and Technology Beijing)
17:20   1367   In Situ Electrochemical Electron Microscopy (4) - Combination of SEM and EDX for Redox Reaction at Electrode Surface S. Arimoto and S. Kuwabata (Osaka University)
17:40   1368   Exploiting Phase Separation in Electrodeposition of Binary Alloys Z. Liu, P. Searson and L. Guo (Johns Hopkins University)
 

Tuesday, October 9, 2007

Military Room, Concourse Level

N/A

Co-Chair(s): N. J. Tao and E. J. Podlaha-Murphy
TimeAbs#Title and Authors
08:00   1369   Template-Free Electrochemical Synthesis of Polypyrrole Nanostructures C. Debiemme-Chouvy (Laboratoire Interfaces et Systèmes Electrochimiques)
08:20   1370   Electrochemical Processing of Nanoscale Si Thin Film in a Hydrophobic Room-Temperature Molten Salt Y. Nishimura, Y. Fukunaka, T. Nohira and R. Hagiwara (Kyoto University)
08:40   1371   Gravitational Effects on Electrochemical Processing of ZnO Nanowire Arrays H. Osaki, H. Yasuda, Y. Kanemitsu and Y. Fukunaka (Kyoto University)
09:00   1372   Electrodeposition of Germanium Nanostructures Q. Huang (IBM), H. Deligianni and L. Romankiw (IBM TJ Watson Research Center)
09:20   1373   Synthesis of Bi2Te3 Nanotubes by Displacement Reaction F. Xiao (University of California- Riverside), B. Yoo (University of California Riverside), K. Lee (Korean Institute of Machinery & Materials) and N. Myung (University of California, Riverside)
09:40 Intermission (20 Minutes)
 
Co-Chair(s): E. J. Podlaha-Murphy and N. V. Myung
TimeAbs#Title and Authors
10:00   1374   Finite Size Effects in Electrochemical Nucleation and Growth P. Searson (Johns Hopkins University)
10:30   1375   Electrochemical Nucleation and Growth of Copper on Resistive Substrates A. Radisic (IMEC vzw), P. Boelen (Applied Materials, Belgium), A. Rosenfeld (Applied Materials Inc., Santa Clara, CA, USA), J. Hernandez, G. Beyer and P. Vereecken (IMEC vzw, B-3001 Leuven, Belgium)
10:50   1376   Electroplating of Copper-Alumina Nanocomposite Films with an Impinging Jet Electrode S. Osborne, W. Sweet (University of California, San Diego), D. Thiemig (Dresden University of Technology) and J. Talbot (University of California, San Diego)
11:10   1377   Prevention of Blister Formation in Electroless Deposited Copper Film on Organic Substrates S. Lee and H. Nam (Samsung Electro-Mechanics Co., LTD.)
11:30   1378   Influence of Chloride, Sulfamate and Thiourea on the Electrodeposition of Copper W. Shao and G. Zangari (University of Virginia)
11:50   1379   Synthesis of Copper Nanostructures by Electrodeposition T. A. Arzhanova and V. G. Kuryavyi (Institute of Chemistry)
 
Co-Chair(s): J. Mallets and J. Talbot
TimeAbs#Title and Authors
14:00   1380   Protein Aided Nanomanufacturing: The Convergence of Electrochemistry, Protein Engineering, and Microtechnology D. T. Schwartz, S. Kitayaporn, F. Baneyx and J. Nelson (University of Washington)
14:30   1381   Nucleation and Growth of Low-Dimensional Noble Metal Structures Using Galvanic Displacement of UPD Monolayers D. Gokcen, S. Bae and S. R. Brankovic (University of Houston)
15:00   1382   Octadecanethiol SAMs as Molecular Resists for Electrodeposition of Cobalt B. OBrien, K. Stebe and P. Searson (Johns Hopkins University)
15:20   1383   Permeability and Magneto-Impedance of Electroplated Permalloy Thin Films W. Bang, K. Hong (Chungnam National University) and H. Lee (Kongju National University)
15:40   1384   Fundamental Studies on Electrodeposition of CoPt Alloy Films with Perpendicular Orientation X. Xu and G. Zangari (University of Virginia)
16:00 Intermission (20 Minutes)
16:20   1385   Electrodeposition of Sm-Co Permanent Magnets From Aqueous Media J. Wei, M. Schwartz and K. Nobe (UCLA)
16:40   1386   Electrodeposition of Laminated Magnetic Alloys for the Application of Magnetic Recording M. Sun, I. Tabakovic, S. Riemer and M. Kief (Seagate Technology)
17:00   1387   Effect of Additives for Ni Electrodeposition on Submicrometer Trenches C. Lee and T. Moffat (National Institute of Standards and Technology)
17:20   1388   Effect of New Electroless Nickel Alloy Films as Intermediate Layer on Au/Ni-P Films I. Koiwa, Y. Wakuda (Kanto Gakuin University), T. Muramatsu, H. Watanabe (Kojima Chemicals Co. Ltd.) and H. Honma (Kanto Gakuin University)
17:40   1389   Interconnection of Multi-Pad Electrodes by "Controlled Anisotropic Extraneous (CAEx) Deposition" of Electroless NiB Film T. Yokoshima, Y. Yamaji, H. Oosato, Y. Tamura, K. Kikuchi, H. Nakagawa and M. Aoyagi (National Institute of Advanced Industrial Science and Technology (AIST))
18:00   1390   The Effects of Current Conditions on the Defect Free Deep Via Fill with Reduced Overburden E. Im, T. Kim, J. Byun, T. Kim, K. Won and H. Nam (Samsung Electro-Mechanics Co., LTD.)
 

Exhibit Hall, Concourse Level

Poster Session

Co-Chair(s): N. V. Myung and N. J. Tao
TimeAbs#Title and Authors
o   1391   CdS Films Dposited by the Pulse Plating Technique and Their Characteristics K. R. Murali (CECRI), K. Thilakavathy, V. Vasantha (Coimbatore Institute of Technology) and R. Ooman (Avinashilingam College for woman)
o   1392   Pulse Plated Cadmium Telluride Films and Their Characteristics K. R. Murali (CECRI), P. Thirumoorthy (KSR College) and V. Sengodan (SNR College)
o   1393   ZnS Flms Deposited by the Pulse Plating Technique and Their Characteristics K. R. Murali (CECRI), S. Vasantha, T. Thilakavathy (CIT) and K. Rajamma (Sri Avinashilingam College)
o   1394   Study of the Microstructure, Chemical Composition, and Electronic Properties of Semiconductor InSb Nanowires Grown by Electrochemical Deposition F. Vitse, L. Tsakalakos, F. Sharifi and W. Heward (General Electric)
o   1395   Electrochemical Deposition of Copper Pentagonal Microcrystals G. I. Ostapenko, D. A. Denisova and A. A. Vikarchuk (Tolyatti State University)
o   1396   Fast Growth of Cu-Sn Layers Through Reduction-Diffusion Method Using Ionic Liquid Bath at Medium-Low Temperatures K. Murase, A. Ito and H. Sugimura (Kyoto University)
o   1397   Electrochemical Synthesis of 1.47 eV-Bandgap Ag2O Particles Y. Ida (Doshisha University), M. Izaki, T. Shinagawa, M. Chigane (OMTRI), M. Inaba and A. Tasaka (Doshisha University)
o   1398   Photoselective Electroless Deposition of Ni-Cu Employing TiO2-Pd2+ Layers K. Song, C. Noh, S. Cho and T. Byk (Samsung Advanced Institute of technology)
o   1399   Cathodic Electrosynthesis of Manganese Dioxide Films J. Wei and I. Zhitomirsky (McMaster University)
o   1400   Electrochemical Synthesis of Polyaniline From Aniline/Cyclodextrin Inclusion Complex M. Kraljić Roković, Z. Mandić and B. Perši (Faculty of Chemical Engineering and Technology)
o   1401   Electrodeposition of ZnSe Thin Films on Pt Polycrystalline Substrate V. C. Fernandes (Universidade Federal de Sáo Carlos) and L. H. Mascaro (Universidade Federal de São Carlos)
o   1402   Electrodeposition of CoWP Thin Films on Copper Stacked on Silicon Wafer H. Yun, S. Dulal, T. Kim, C. Park, C. Shin and C. Kim (Ajou University)
o   1403   Effect of Deposition Modes on Composition and Microstructure of Electrodeposited CoWP Film W. Jeon, S. Dulal, H. Yun, Y. Namkoung, T. Naz, C. Shin and C. Kim (Ajou University)
o   1404   Characteristics of W- and Ti-doped VO2 Thin Films Prepared by Sol-Gel Method B. Chae, H. Kim, S. Yun, S. Choi, B. Kim and Y. Lee (ETRI)