Honolulu PRiME 2012 - Honolulu, Hawaii

October 7 - October 12, 2012



F2 - Electrodeposition General Session: Fundamentals and New Materials - Dieter M. Kolb Memorial Symposium


Monday, October 8, 2012

313B, Level 3, Hawaii Convention Center

Session I

Co-Chairs: R.Alkire, T. Homma
TimeProgr#Title and Authors
08:00 Introductory Remarks (20 Minutes)
08:20   3262   On the Structure of the Helmholtz Layer at the Solid-Electrolyte Boundary and its Relation to Electrode Kinetics H. J. Lewerenz (California Institut of Technology)
09:00   3263   Metal Deposition on Metal, Semiconductor, Organic Layer - Common Interests with Prof. Dieter Kolb K. Uosaki (NIMS)
09:40 Intermission (20 Minutes)

Session II: UPD and Adsorption

Co-Chairs: T. Homma and R. Alkire
TimeProgr#Title and Authors
10:00   3264   Underpotential Deposition of Cu on Au(111) in Acid Sulfate Solution N. Vasiljevic (University of Bristol), L. Viyannalage (SUNY-Binghamton), N. Dimitrov (SUNY at Binghamton), and K. Sieradzki (Arizona State University)
10:20   3265   Tuning the Driving Force in Underpotential Codeposition of Alloys via Selective Complexation: Application to Au-Cu Alloys D. Liang and G. Zangari (University of Virginia)
10:40   3266   Lead Underpotential Deposition on Sub-Monolayer Pt and Ru Modified Au(111) Surface Q. Yuan, A. Tripathi, M. Slavkovic, and S. Brankovic (University of Houston)
11:00   3267   EC-STM Study of Two-Dimensional Complex Adlayer Directly Formed on Au(111) S. Yoshimoto (Kumamoto University) and K. Nishiyama (Kumamoto Univ.)
11:20   3268   Characterisation of the Deposition of n-octanohydroxamate on Copper Surfaces G. K. Parker (Griffith University), S. Holt (Australian Nuclear Science and Technology Organisation), and G. Hope (Griffith University)
11:40   3269   Electrochemical Formation of Cu-Corronene Adlayer on Au(111) in Acidic Solution T. Sawaguchi (National Institute of Advanced Industrial Science and Technology) and S. Yoshimoto (Kumamoto University)

Session III: Thin Film Electrodeposition

Co-Chairs: K. Uosaki and L. Kibler
TimeProgr#Title and Authors
14:00   3270   E-ALD of Pd on Au Single Crystals L. Sheridan, Y. Kim, J. Stickney (The University of Georgia), and D. B. Robinson (Sandia National Laboratories)
14:20   3271   Layer-by-layer Pt Electrodeposition on Au Single Crystal Surfaces Studied by In situ Resonance Surface X-ray Scattering T. Kondo, M. Shibata (Ochanomizu University), T. Masuda, and K. Uosaki (NIMS)
14:40   3272   The Evolution of Surface Morphology and Stress in Electrodeposited Copper Nanofilms M. O'Grady, C. Lenihan (Materials and Surface Science Institute, University of Limerick), and D. Buckley (University of Limerick)
15:00   3273   Electrochemical Impedance Spectroscopy Applied to Cantilever Curvature M. C. Lafouresse, U. Bertocci, C. Beauchamp, and G. Stafford (NIST)
15:20   3274   Controlling Pt Nucleation and Growth by Solution Chemistry and Deposition Conditions Y. Liu, D. Gokcen (National Institute of Standards and Technology), U. Bertocci (NIST), and T. Moffat (National Institute of Standards and Technology)
15:40   3275   XAS Study of Core-Shell PtRu Nanoparticles from Galvanic Pulse Current Deposition Y. Hsieh (National Chiao Tung University), L. Chang (Graduate Program for Science and Technology of Accelerator Light Source), P. Wu (Department of Materials Science and Engineering National Chiao Tung University), and J. Lee (National Synchrotron Radiation Research Center)

Tuesday, October 9, 2012

313B, Level 3, Hawaii Convention Center

Session III Cont'd: Thin Film Electrodeposition

Co-Chairs: G. Zangari and R. Sawaguchi
TimeProgr#Title and Authors
08:00   3276   Electroforming of Thick Film Bi2Te3-based Thermoelectrics C. L. Arrington, P. Sharma, J. Coleman, E. Baca, A. Rowen, D. Banga, D. B. Robinson, and V. Stavila (Sandia National Laboratories)
08:20   3277   Electrodeposition of SbxTey and BixTey Thin Films for Thermoelectric application J. Lim (Korea Institutte of Materials Science), I. Yoo (KIMS), N. Myung (University of California - Riverside), Y. Song, D. Chang, D. Lim (Korea Institute of Materials Science), Y. Kim (Pusan National University), and K. Lee (Korea Institute of Materials Science)
08:40   3278   Wear and Corrosion Resistance of Cr-C Deposits Obtained from a Trivalent Chromium Electroplating Bath with the Addition of Nanosized Al2O3 Powder C. Huang, C. Chuang, and C. Lin (Chang Gung University)
09:00   3279   Effects of Sonication on Electrodeposited Nickel-based Carbon Nanotube Composites Coatings T. Suzuki and M. Kato (Yamagata Research Institute of Technology)
09:20   3280   Application of Artificial Neural Networks to Predict Chemical Composition of Electrodeposited Nanocrystalline Ni-Mo Thin Films M. Allahyarzadeh (Abadan faculty of Petroleum Engineering), A. Ashrafi (Shahid Chamran University of Ahvaz), B. Roozbehani (Abadan faculty of Petroleum Engineering), and A. Seddighian (Sharif University of Technology)
09:40 Intermission (20 Minutes)
10:00   3281   Stepwise Anodizing Processes for Hierarchical Nanoporous Structures C. Jeong and C. Choi (Stevens Institute of Technology)
10:20   3282   Dependence of Fermi Level in Conducting Polymers Joined with Oxide Semiconductor on Its Crystal Plane Y. Fujikawa (Chiba Institute of Technology), J. Kawakita, T. Chikyow (National Institute for Materials Science), and Y. Sakamoto (Chiba Institute of Technology)
10:40   3283   Photoluminescence Properties of Electrodeposited Porous Silicon/ Cerium oxide Composite M. Mizuhata and Y. Kubo (Kobe University)

Session IV: Deposition

Co-Chairs: S. Yoshimoto and S. Brankovic
TimeProgr#Title and Authors
11:00   3284   Superconformal Film Growth: Challenges and Opportunities T. Moffat, G. Liu (National Institute of Standards and Technology), S. Zou (Miami University), L. Richter (National Institute of Standards and Technology), L. Ou Yang (TSMC), C. Lee (KAERI), and D. Josell (National Institute of Standards and Technology)
11:20   3285   Beyond Interfacial Anion/Cation Pairing: The Role of Cu(I) Coordination Chemistry for the Action of Leveler Additives in Copper Electroplating M. Hai, F. Janser, T. Brunner (University of Bern), A. Fluegel (BASF SE), F. Simona, M. Cascella, K. Kraemer (University of Bern), D. Mayer, M. Arnold (BASF SE), and P. Broekmann (University of Bern)
11:40   3286   Influence of Glycine as Additive on Cobalt Electrodeposition R. A. Critelli and P. Sumodjo (Universidade de São Paulo)

Session IV Cont'd: Deposition

Co-Chairs: U. Stimming and T. Kondo
TimeProgr#Title and Authors
14:00   3287   Mechanistic Studies of Zinc Electrodeposition from Deep Eutectic Electrolytes L. Vieira (CEST Competence Centre for Electrochemical Surface Technology), B. Gollas (Graz University of Technology), and R. Schennach (Institute of Solid State Physics, Graz University of Technology)
14:20   3288   Theoretical Analysis of the Solvent Effect on Hypophosphite Ion Adsorption on Pd and Cu Surfaces M. Kunimoto, K. Seki, H. Nakai, and T. Homma (Waseda University)
14:40   3289   Electrodeposition of FeRh Alloys: Influence of Ag Underlayer R. Della Noce (Unesp), D. Cornejo, H. Kumar (USP), and A. Benedetti (Unesp)
15:00   3290   Surface Alloy Formation During Pb UPD on Cu(100) and Its Role in Cu-Pb Alloy Deposition D. Gokcen, C. Hangarter, and T. Moffat (National Institute of Standards and Technology)
15:20   3291   An Environmentally Friendly Process for Electroplating Copper on Zinc C. Liao, F. Ernst, and U. Landau (Case Western Reserve University)
15:40   3292   Study of the Copper Electrodeposition Mechanism on Molybdenum Substrate E. Delbos, H. El Belghiti (OMG Ultra Pure Chemicals), D. Mercier, J. Vigneron, M. Bouttemy, and A. Etcheberry (Institut Lavoisier de Versailles)
Co-Chairs: L. Kibler and M. Mizuhata
TimeProgr#Title and Authors
16:00   3293   Deposition of Metallic Nanoparticles; Variations of Particle Size T. Brülle, O. Schneider (Technische Universität München), and U. Stimming (TUM CREATE Centre for Electromobility)
16:20   3294   Electrodeposition of Arrays of Au/NiO/Au Nanowire Heterostructures for ReRAM Applications D. Perego, S. Franz, M. Bestetti (Politecnico di Milano), S. Brivio, G. Tallarida (Laboratorio MDM, IMM-CNR), and S. Spiga (CNR-IMM)
16:40   3295   Crystal Orientation of Iron Produced by Electrodeoxidation of Hematite Particles M. Tokushige (Norwegian University Science Technology), O. Kongstein (SINTEF), and G. Haarberg (Norwegian University of Science and Technology)
17:00   3296   Study of the Electrodeposition of Zn-TiO2 Dispersion Coatings M. K. Camargo (Ilmenau University of Technology), U. Schmidt (Technische Universitaet Ilmenau), and A. Bund (Technische Universität Ilmenau)
17:20   3297   Epitaxial Growth of Au on Pt (111) and Pt (poly) by Surface Limited Redox Replacement of Pb UPD Layer N. Dimitrov, C. Mitchell, and M. Fayette (SUNY at Binghamton)
17:40   3298   Implications on the Use of 1-D and 2-D Models for Metal Electrodeposition: Voltammetry and Impedance Analysis J. G. Vazquez and M. Pritzker (University of Waterloo)

Kamehameha Exhibit Hall 3, Level 1, Hawaii Convention Center

F2 - Poster Session

TimeProgr#Title and Authors
o   3299   Understanding the Mechanism of Functional Molecules in Shape-Controlled Synthesis of Nanomaterials -- In Situ FTIR Spectroscopic Study of Citrate Adsorption on Pt Polycrystalline and Single Crystal Electrodes D. Chen, J. Ye, C. Xu, X. Li, J. Li, C. Zhen, and S. Sun (Xiamen University)
o   3300   Fabrication of Low CTE Metal Masks by the Invar Fe-Ni Alloy Electroforming Process for Large and Fine Pitch OLED Displays T. Nagayama, T. Yamamoto, T. Nakamura, and Y. Mizutani (Kyoto municipal institute of industrial technology and culture)
o   3301   Synthesis and Characterization of Electrodeposited Cu2O Thin Film for Photo-Electrochemical Cells M. Kim (Korea Institute of Materials Science), S. Yoon (Hanyang University), D. Chang (Korea Institute of Materials Science), N. Myung (University of California - Riverside), D. Lim (Korea Institute of Materials Science), I. Kim (Dong-A university), B. Yoo (Hanyang University), K. Lee (Korea Institute of Materials Science), and J. Lim (Korea Institutte of Materials Science)
o   3302   Characterization of Zn-Ni-P alloys Electrodeposited in Alkaline Solutions Y. Kamimoto, K. Yamamoto, S. Yamashita, and R. Ichino (Nagoya University)
o   3303   The Electrodeposition of Zinc-Bismuth Alloys A. Luegger (CEST Competence Centre for Electrochemical Surface Technology), B. Gollas (Graz University of Technology), and J. Zidar (Miba Gleitlager GmbH)
o   3304   Influence of Adatom Supersaturation on Real Activation Energy of Charge Transfer Stage during Metal Electrocrystallization I. Kryshtop, N. Yurchenko, and V. Trofimenko (Dnipropetrovsk National University)
o   3305   Electrochemical Assembly of Ruthenium Complexes during the Multilayering Process of MnO2 K. Tomono, R. Yamaguchi, and M. Nakayama (Yamaguchi University)
o   3306   AFM Analysis for Initial Stage of Electroless Displacement Deposition of Silver on Silicon Surface T. Ego (Graduate school of Engineering, University of Hyogo), S. Yae (University of Hyogo), T. Hagihara (Shinko seiki Co., Ltd.), N. Fukumuro, and H. Matsuda (University of Hyogo)
o   3307   Fabrication of Cu-Ag Film Using Electrodeposition and Characterization of Its Properties H. Ko (University of Incheon), M. Kim, J. Kim (Seoul National University), and O. Kwon (University of Incheon)
o   3308   Degradation of Additives and Its Influences on Copper Electrodeposition S. Choe, M. Kim, H. Kim, T. Lim (Seoul National University), A. Lee, S. Jun, K. Woo (LS Mtron Ltd.), and J. Kim (Seoul National University)
o   3309   Electrodeposition of CoNiW Alloys: HCP-FCC Structural Transition A. M. Sakita (Instituto de Química - Unesp), R. Della Noce, C. Sadao Fugivara, and A. Vicente Benedetti (Unesp)
o   3310   Electrochemical Formation of Functional Silver Coatings: Nanostructural Peculiarities O. Bersirova and V. Kublanovsky (V.I.Vernadskii Institute of General and Inorganic Chemistry NAS of Ukraine)
o   3311   High Temperature Hardness of Electrodeposited Nickel-based Carbon Nanotube Composite Coatings T. Suzuki, M. Kato, T. Matsuda, and S. Kobayashi (Yamagata Research Institute of Technology)