199th Meeting - Washington, DC

March 25-30, 2001


K1 - Electrochemical Processing in ULSI Fabrication and Electrodeposition of and on Semiconductors IV

Electrodeposition Division/Dielectric Science and Technology Division/Electronics Division

Tuesday, March 27, 2001

Room 3, Meeting Room Level

Copper On-Chip Metallization

Co-Chairs: P.C. Andricacos and P.C. Searson

1:30304 A Superfilling Model that Predicts Bump Formation - A. West (Columbia University), S. Mayer, and J. Reid (Novellus Systems) PDF
1:45305 Integrated Multiscale Simulation of Copper Electrochemical Deposition Processes - M. Bloomfield, K. Jansen, and T. Cale (Rensselaer Polytechnic Institute) PDF
2:00306 A Computationally Efficient Feature Scale Model and Experimental Study for Copper Electrodeposition in the Presence of Additives - G.-S. Kim (Massachusets Institute of Technology), T. Merchant (Motorola Semiconductor Product Sector), J. D'Urso (Motorola Labs), and K. Jensen (Massachusets Institute of Technology) PDF
2:15307 Electrochemical Deposition of Copper on Non-metallic Substrates for ULSI Applications - M. Shaw and D. Duquette (Rensselaer Polytechnic Institute) PDF
2:30308 Investigation of the Effects of Byproduct Components in Cu Plating for Advanced Interconnect Metallization - L.-T. Koh, G.-Z. You, C.-Y. Li, and P.-D. Foo (Institute of Microelectronics) PDF
2:45309 Galvanostatic Method for Quantification of Organic Suppressor and Accelerator Additives in Acid Copper Plating Baths - P. Roberston (ATMI Analytical Systems), D. Fulton (Semitool Inc.), and Y. Tolmachev (ATMI Analytical Systems) PDF
3:00 Thirty-Minute Intermission
3:30310 Copper Interconnection via Displacement Deposition atop Nitride Barrier Layer and Underneath Silicon Substrate - Y. Wu, Y.-Y. Wang, and C.-C. Wan (Tsing-Hua University) PDF
3:45311 The Effects of Cleaning and Pre-treatment on the Electroless Copper Deposition - Y.-J. Oh and C.-H. Cung (Sungkyunkwan University) PDF
4:00312 An Acid-Based Electroless Cu Deposition Process: Chemical Formulation, Film Characteristics and CMP Performance - W.-T. Tseng, C.-H. Lo, and S.-C. Lee (WaferTech, LLC) PDF
4:14313 Electrochemical Effects of Various Oxidants on Cu-CMP in Ammonia-Based Slurries - S.-C. Yen and T.-H. Tsai (National Taiwan University) PDF

Wednesday, March 28, 2001

ULSI Applications of Electrodeposition, ALE and Magnetic Films

Co-Chairs: J.L. Stickney and P.C. Andricacos

10:00314 Electrodeposition of Thermoelectric Materials for Quantum Cold Point Coolers - U. Ghoshal, E. Cooper, and P. Andricacos (IBM Research) PDF
10:30315 Integration of Thermoelectric Materials Onto SI Using Electrochemical Atomic Layer Epitaxy - Y. Chen, I. Nicic, and C. Shannon (Auburn University) PDF
10:45316 Electrodeposition of Au on Si(111): Towards Nanowire Formation - P. Allongue, M. Munford (Universite P & M Curie), and A. Pasa (UFSC) PDF
11:00 Fifteen-Minute Intermission
11:15317 Sub-Micron Pt Electrodes by Through-Mask Plating - K.L. Saenger (IBM Research Division), G. Costrini (IBM Microelectronics), D.E. Kotecki (University of Maine), K.T. Kwietniak, and P.C. Andricacos (IBM Research Division) PDF
11:30318 Hydrogen Peroxide Oxygen Precursor for Zinc Oxide Electrodeposition - T. Pauporte and D. Lincot (UMR) PDF
11:45319 Experimental Studies on Electrodeposition of CoFe Alloys - H. Xu, T.E. Dinan (IBM Almaden Research Center), E.I. Cooper, L.T. Romankiw (IBM T. J. Watson Research Center), and D. Miller (IBM Almaden Research Center) PDF

ULSI Applications of Electrodeposition, ALE and Magnetic Films (cont'd)

Co-Chairs: P.C. Andricacos and J.L. Stickney

2:00320 Effect of Cu Content and Cu Partial Current on GMR of Electrodeposited Co-Ni-Cu/Cu Multilayers - G. Nabiyouni (University Of Arak, Iran), S. Huo (University of Bristol, UK), S. Roy (University of Newcastle UK), and W. Schwarzacher (University of Bristol, UK) PDF
2:15321 Electrodeposition of Ferromagnetic Thin Films on Semiconductor Substrates - P. Evans, C. Scheck, R. Schad, and G. Zangari (University of Alabama) PDF
2:30322 Electrodeposition of Fe3O4 on Single Crystal Silicon Substrates - T. Sorenson, M. Nikoforov, and J. Switzer (University of Missouri Rolla) PDF
2:45323 Synthesis of Ternary Compounds on Ag(111) by Electrochemical ALE - G. Pezzatini, F. Loglio, M. Innocenti, F. Forni, and M.L. Foresti (University of Florence) PDF
3:00 Fifteen-Minute Intermission
3:15324 Progress in the Formation of Compound Semiconductors using Electrochemical Atomic Layer Epitaxy (EC-ALE) - B. Flowers, T. Wade, R. Vaidyanathen, U. Happek, and J. Stickney (University of Georgia) PDF
3:30325 Ion Transport Modelling in Realistic Thin-Layer ECD for Gravitoconvection Prevailing Regimes - G. Marshall, S. Dengra, E. Arias (UBA), F.V. Molina (INQUIMAE, Facultad de Ciencias Exactas, UBA), M. Vallieres (Drexel University, Department of Physics), and G. Gonzalez (UBA) PDF
3:45326 Failure Analysis by new Scanning Transmission Electron Microscope HD-2000 - M. Koguchi, S. Isakozawa (Hitachi, Ltd.), and M. Iwaki (The Institute of Physical and Cheical Research) PDF