Honolulu PRiME 2012 - Honolulu, Hawaii | ||
October 7 - October 12, 2012 | ||
PROGRAM INFORMATION | ||
E5 - Dielectric Materials and Metals for Nanoelectronics and Photonics 10 | ||
Monday, October 8, 2012 | ||
313A, Level 3, Hawaii Convention Center | ||
Non Volatile Memory | ||
Co-Chairs: Albert Chin, Samares Kar | ||
| Time | Progr# | Title and Authors |
|---|---|---|
| 10:00 | Introductory Remarks (10 Minutes) | |
| 10:10 | 2574 | Ultra-Low Switching Power RRAM Using Hopping Conduction Mechanism A. Chin, Y. Chiu (National Chiao-Tung University), C. Cheng (National Taiwan Normal University), Z. Zheng, and M. Liu (Chinese Academy of Sciences) |
| 10:40 | 2575 | ALD Grown Functional Oxide Layers for Nonvolatile Resistive Switching Memory Applications S. Hoffmann-Eifert and R. Waser (Forschungszentrum Juelich) |
| 11:10 | 2576 | Hafnium Oxide Based CMOS Compatible Ferroelectric Materials U. Schroeder (Namlab gGmbH), J. Mueller (Fraunhofer CNT), E. Yurchuk, S. Mueller, D. Martin, S. Slesazeck, and T. Mikolajick (Namlab gGmbH) |
| 11:40 | 2577 | HfO2-based RRAM for Embedded Nonvolatile Memory: From Materials Science to Integrated 1T1R RRAM Arrays T. Bertaud, C. Walczyk, D. Walczyk, M. Sowinska, D. Wolansky, B. Tillack, G. Schoof, C. Wenger (IHP), S. Thiess (DESY), and T. Schroeder (IHP) |
| 12:10 | 2578 | Resistive Switching of Iron Oxide Nanoparticles in Patterned Array Structure on Flexible Substrate J. Kim, J. Yoo, Y. Baek, H. Kim, Q. Hu, C. Kang, and T. Yoon (Myongji University) |
Novel Dielectrics | ||
Co-Chairs: Joerg Osten, Sven Van Elshocht | ||
| Time | Progr# | Title and Authors |
| 13:50 | 2579 | Theoretical Perspectives in Defect and Impurity Physics toward Materials Design for Oxides N. Umezawa (National Institute for Materials Science) |
| 14:20 | 2580 | Strain-induced effects on dielectric properties of thin, crystalline rare earth oxides on silicon H. Osten and D. Schwendt (Leibniz University) |
| 14:50 | 2581 | Epitaxial Si and Gd2O3 Heterostructures - Distributed Bragg Reflectors with Stress Management Function for GaN on Si Light Emitting Devices R. Dargis, A. Clark, E. Arkun, R. Roucka, D. Williams, R. S. Smith, and M. Lebby (Translucent Inc.) |
| 15:10 | 2582 | Room Temperature Ferromagnetism Induced by Electric Field in Cobalt-Doped TiO2 T. Fukumura (University of Tokyo) |
| 15:40 | 2583 | Enhancement of Dielectric Properties and Magnetic Coupling of Pb(Fe0.5Nb0.5)O3 by Doping Ni0.65Zn0.35Fe2O4 S. K. Barik, D. Pradhan, S. Sahoo, V. Pauli, and R. Katiyar (University of Puerto Rico) |
Tuesday, October 9, 2012 | ||
313A, Level 3, Hawaii Convention Center | ||
Ge Channel | ||
Co-Chairs: Koji Kita | ||
| Time | Progr# | Title and Authors |
| 09:00 | 2584 | Conduction Band-offset in GeO2/Ge Stack Determined by Internal Photoemission Spectroscopy W. Zhang, T. Nishimura, K. Nagashio, K. Kita, and A. Toriumi (The University of Tokyo) |
| 09:20 | 2585 | Hydrogen Interaction with HfO2 Films Deposited on Ge(100) and Si(100) G. V. Soares (UFRGS), T. Feijó (IF-UFRGS), I. Baumvol (IF-UFRGS and UCS), C. Aguzzoli (UCS), C. Krug (IF-UFRGS and CEITEC S.A), and C. Radtke (IQ-UFRGS) |
InGaAs and GaAs Passivation | ||
Co-Chairs: Susanne Stemmer, Heiji Watanabe | ||
| Time | Progr# | Title and Authors |
| 10:00 | Award Ceremony (10 Minutes) | |
| 10:10 | 2586 | MOS Interface Control of High Mobility Channel Materials for Realizing Ultrathin EOT Gate Stacks S. Takagi, R. Zhang, R. Suzuki, N. Taoka, M. Yokoyama, and M. Takenaka (The University of Tokyo) |
| 10:40 | 2587 | III-V/Oxide Interfaces Investigated with Synchrotron Radiation Photoemission Spectroscopy M. Tallarida (Brandenburg University of Technology) |
| 11:10 | 2588 | Unit Cell by Unit Cell Cleaning and Nucleation for ALD Gate Oxide Deposition W. Melitz, T. Kent, E. Chagarov, M. Edmonds (UCSD), T. Kaufman-Osborn (University of California, San Diego), J. Sung Lee (UCSD), K. Kiantaj, and A. Kummel (University of California, San Diego) |
| 11:40 | 2589 | Scaling and Interface Control of High-k/III-V Interfaces S. Stemmer, V. Chobpattana, Y. Hwang (University of California Santa Barbara), and R. Engel-Herbert (The Pennsylvania State University) |
| 12:10 | 2590 | Effect of In0.53Ga0.47As surface Nitridation on Electrical Characteristics of High-k/ Capacitors Y. Suzuki, D. Zadeh, K. Kakushima, P. Ahmet, Y. Kataoka, A. Nishiyama, N. Sugii, K. Tsutsui, K. Natori, T. Hattori, and H. Iwai (Tokyo Institute of Technology) |
Metal Work Function Tuning | ||
Co-Chairs: Akira Toriumi, Atif Noori | ||
| Time | Progr# | Title and Authors |
| 14:00 | 2591 | Interface Dipole Cancellation in SiO2/High-k/SiO2/Si Gate Stacks S. Hibino, T. Nishimura, K. Nagashio, K. Kita, and A. Toriumi (The University of Tokyo) |
| 14:20 | 2592 | Phenomena of Dielectric Capping Layer Insertion into High- κ Metal Gate Stacks in Gate-First/Gate-Last Integration H. Jagannathan, P. Jamison, and V. Paruchuri (IBM Research) |
| 14:40 | 2593 | Conformal Metal Gate Process Technology for 14nm Logic Node and Below A. M. Noori, A. Brand, Y. Lei, M. Chen, W. Tang, X. Lu, X. Fu, S. Ganguli, J. Anthis, D. Thompson, N. Yoshida, M. Xu, M. Chang, and S. Gandikota (Applied Materials) |
| 15:10 | 2594 | Investigation of Mg Diffusion in Ta(N) based Electrodes on HfO2 for sub-32nm CMOS Gate-Last Transistors R. Gassilloud, C. Maunoury, C. Leroux (CEA France), P. Chevalier (STMicroelectronics), C. Dressler, F. Aussenac, F. Martin (CEA France), D. Bensahel (STMicroelectronics), and S. Maitrejean (CEA France) |
FinFET and 3-D Transistors | ||
Co-Chairs: Kaushik Roy, Durga Misra | ||
| Time | Progr# | Title and Authors |
| 15:40 | 2595 | Device-Circuit Co-design of FinFETs in Scaled Technologies S. Gupta and K. Roy (Purdue University) |
| 16:10 | 2596 | Independent-Double-Gate FinFET SRAM Technology K. Endo, S. O'uchi, Y. Liu, T. Matsukawa, and M. Masahara (AIST) |
| 16:40 | 2597 | Electrical Characterization and Reliability Assessment of Double-gate FinFETs C. D. Young, K. Akarvardar, K. Matthews (SEMATECH), M. Baykan (U. of Florida - Gainesville), J. Pater, I. Ok, T. Ngai, K. Ang, M. Minakais, G. Bersuker, C. Hobbs, P. Kirsch, and R. Jammy (SEMATECH) |
| 17:10 | 2598 | Current Status of High-k and Metal Gates in CMOS G. Wilk, M. Verghese, P. Chen (ASM America), and J. Maes (ASM Belgium) |
Kamehameha Exhibit Hall 3, Level 1, Hawaii Convention Center | ||
E5 - Poster Session | ||
Co-Chairs: Durga Misra, Samares Kar | ||
| Time | Progr# | Title and Authors |
| o | 2599 | Roles of Target Composition on the Dielectric Property of RF Sputtered Bi2O3-ZnO-Nb2O5 Pyrochlore Thin Film K. Ko, M. Lim, B. Lee, H. Lee, and J. Choi (Ajou University) |
| o | 2600 | Effect of Erbium Silicide Crystallinity for Low Barrier Contact Between Erbium Silicide and n-type Silicon H. Tanaka, A. Teramoto, S. Sugawa, and T. Ohmi (Tohoku University) |
| o | 2601 | Measurement and Identification of Three Contributing Charge Terms in Negative bias Temperature Instability C. Mayberry (AFRL), D. Nguyen, C. Kouhestani (AFRL/RVSE), K. Kambour (SAIC), H. Hjalmarson (Sandia National Laboratories), and R. Devine (AFRL/RVSE) |
| o | 2602 | Process to Etch Ni and Pt Residues during Silicide Contact Electrode Processing using Low Temperature Aqueous Solutions A. N. Duong (Intermolecular Inc), C. Fitz, S. Metzger (Globalfoundries), O. Karlsson, J. C. Foster, G. Nowling (Intermolecular Inc), V. Sih, and P. Besser (Globalfoundries) |
| o | 2603 | Correlation between Electrical and Optical Properties of Tantalum Anodic Oxide and Electron Cyclotron Resonance Etching Studies of E-beam Deposited Ta2O5 Films A. Kulpa and N. Jaeger (The University of British Columbia) |
| o | 2604 | Area Dependence of Reliability characteristics for Atomic Layer Deposition HfO2 Film under Static and Dynamic Stress Y. Cheng, Y. Chang, C. Hsieh, and J. Lin (National Chi-Nan University) |
| o | 2605 | CANCELLED
Characterization of Sol-Gel-Derived Crystalline HfO2 -Y2O3 Thin Films on Si(001) Substrates
H. Shimizu and T. Nishide (Nihon University)
|
| o | 2606 | CANCELLED
Comparison on Physical and Electrical Properties of Sputtered Ru and RuO2 Gate Electrodes Grown on HfO2/Si for p-MOSFET
H. Kim, S. Lee, I. Yu, J. Lee (Seoul National University), T. Park (Hanyang University), and C. Hwang (Seoul National University)
|
| o | 2607 | MOSFETs on InP Substrate with LaAlO3/HfO2 Bilayer of Different LaAlO3 Thickness and Single LaXAl1-XO Layer with Different La Doping Level Y. Wang, Y. Chen, F. Xue, F. Zhou, Y. Chang, and J. Lee (The University of Texas at Austin) |
| o | 2608 | Thiol-Ene Reaction Derived Sol-Gel Hybrid Dielectric Layer for Oragnic Thin Film Transistors J. Kim, Y. Kim, J. Ko (Korea Advanced Institute of Science and Technology), and B. Bae (Korea Advanced Institute of Science ad Technology (KAIST)) |
| o | 2609 | Comprehensive Study on Chemical Structures of Compositional Transition Layer at SiO2/Si(100) Interface T. Suwa, A. Teramoto (Tohoku University), T. Muro, T. Kinoshita (Japan Synchrotron Radiation Research Institute), S. Sugawa, T. Hattori, and T. Ohmi (Tohoku University) |
Wednesday, October 10, 2012 | ||
313A, Level 3, Hawaii Convention Center | ||
Strain Characterization | ||
Co-Chairs: Samares Kar | ||
| Time | Progr# | Title and Authors |
| 09:00 | 2610 | Development of Ultrathin Gold Film Tensile Testing by Floating Specimen on Water Surface J. Kim, A. Nizami (KAIST), H. Lee, S. Hyun (Korea Institute of Machinery and Materials), and T. Kim (KAIST) |
| 09:20 | 2611 | Characterization of Stress Transfer from Process Induced Stressor Layer to Substrate in MOSFETs R. THOMAS, D. Benoit, A. Pofelski, L. Clement, P. Morin (STMicroelectronics), D. Cooper (CEA LETI), and F. Bertin (CEA-LETI) |
Nano-Wire Technology | ||
Co-Chairs: Hemanth Jagannathan, Kajuhiko Endo | ||
| Time | Progr# | Title and Authors |
| 10:00 | 2612 | Si Nanowire Technology H. Iwai (Tokyo Institute of Technology) |
| 10:30 | 2613 | Fabrication of High-Quality GOI and SGOI Structures by Rapid Melt Growth Method - Novel Platform for High-Mobility Transistors and Photonic Devices - H. Watanabe, Y. Suzuki, S. Ogiwara, N. Kataoka, T. Hashimoto, T. Hosoi, and T. Shimura (Osaka University) |
| 11:00 | 2614 | A Study of Metal Gates on HfO2 using Si Nanowire Field Effect Transistors as Platform Q. Li (George Mason University), H. Zhu, H. Yuan, O. Kirillov (NIST), D. Ioannou (George Mason University), J. Suehle, and C. A. Richter (NIST) |
EOT Scaling | ||
Co-Chairs: Shinichi Takagi, Sven Van Elshocht | ||
| Time | Progr# | Title and Authors |
| 11:20 | 2615 | Aggressive SiGe Channel Gate Stack Scaling by Remote Oxygen Scavenging: pFET Performance and Reliability M. M. Frank, E. A. Cartier, T. Ando, S. W. Bedell, J. Bruley, Y. Zhu, and V. Narayanan (IBM T.J. Watson Research Center) |
| 11:40 | 2616 | Interface Properties La-Silicate MOS Capacitors with Tungsten Carbide Gate Electrode for Scaled EOT T. Kamale (Tokyo Institute of Technology), R. Tan (Ningbo University), K. Kakushima, P. Ahmet, Y. Kataoka, A. Nishiyama, N. Sugii, K. Tsutsui, K. Natori, T. Hattori, and H. Iwai (Tokyo Institute of Technology) |
| 12:00 | 2617 | Remote Scavenging Technology using Ti/TiN Capping Layer Interposed in a Metal/High-k Gate Stack X. Ma, X. Wang, K. Han, W. Wang, and T. Ye (Chinese Academy of Sciences) |
Interface Related Studies | ||
Co-Chairs: Andrew Kummel, Koji Kita | ||
| Time | Progr# | Title and Authors |
| 14:00 | 2618 | Band Lineup Issues Related with High-k/SiO2/Si Stack J. Xiang, X. Wang (Chinese Academy of Sciences), T. Li (Institute of Microelectronics of Chinese Academy of Sciences), C. Zhao, W. Wang (Chinese Academy of Sciences), Q. Liang, J. Li (Institute of Microelectronics of Chinese Academy of Sciences), D. Chen, and T. Ye (Chinese Academy of Sciences) |
| 14:20 | 2619 | Schottky Barrier Height at TiN/HfO2 Interface of TiN/HfO2/SiO2/Si Structure K. Han, X. Wang, W. Wang (Chinese Academy of Sciences), J. Zhang (North China University of Technology), J. Xiang, H. Yang, C. Zhao, D. Chen, and T. Ye (Chinese Academy of Sciences) |
| 14:40 | 2620 | SiC MOS Interface States: Similarity and Dissimilarity from Silicon T. Umeda, Y. Satoh (University of Tsukuba), R. Kosugi, Y. Sakuma, M. Okamoto, S. Harada (National Institute of Advanced Industrial Science and Technology), and T. Ohshima (Japan Atomic Energy Agency) |
Device Manufacturing | ||
Co-Chairs: Samares Kar | ||
| Time | Progr# | Title and Authors |
| 15:20 | 2621 | Controlled Lateral Etching of Titanium Nitride in a CMOS Gate Structure using DSP+ J. C. Foster (Intermolecular inc), S. Metzger, and P. Besser (Globalfoundries) |
| 15:40 | 2622 | CANCELLED
The Electrochemical Kinetics of Selectively Corroding Poly-Silicon in Generating Lonely Crater-Defects
L. Sheng and E. Glines (ON Semiconductor)
|
| 16:00 | 2623 | Local-Loading Effects for Pure-Boron-Layer Chemical-Vapor Deposition V. Mohammadi (Delft University of Technology), W. De Boer (TUDelft), T. Scholtes (Delft University of Technology), and L. Nanver (TUDelft) |